Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn–Cu hypereutectic alloy

By Çadırlı E.   Böyük U.   Engin S.   Kaya H.   Maraşlı N.   Keşlioğlu K.   Ülgen A.  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 6, 2010-06 ,pp. : 608-618

Springer Publishing Company

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Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

By Zhu Fulong   Zhang Honghai   Guan Rongfeng   Liu Sheng  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 5, 2006-05 ,pp. : 379-384

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Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate

By Yu S-P.   Wang H-C.   Wang M-C.   Hon M-H.  

Journal of Materials Science, Vol. 37, Iss. 1, 2002-01 ,pp. : 185-190

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The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the Sn–Cd binary alloys

By Kamal Mustafa   El-Bediwi Abu Bakr   El-Ashram Tarek  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 4, 2004-04 ,pp. : 211-217

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Electrical conductivity and viscosity of liquid Sn–Sb–Cu alloys

By Plevachuk Yu.   Sklyarchuk V.   Yakymovych A.   Svec P.   Janickovic D.   Illekova E.  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 6, 2011-06 ,pp. : 631-638

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