Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate

Author： Yu S-P.   Wang H-C.   Wang M-C.   Hon M-H.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.37, Iss.1, 2002-01, pp. : 185-190

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