Curing behavior of epoxy resins with a series of novel curing agents containing 4,4′-biphenyl and varying methylene units

Author: Guo Qing   Huang Yan   Zhang Yu-Ying   Zhu Li-Rong   Zhang Bao-Long  

Publisher: Springer Publishing Company

ISSN: 1388-6150

Source: Journal of Thermal Analysis and Calorimetry, Vol.102, Iss.3, 2010-12, pp. : 915-922

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Abstract