Studies on the curing kinetics of epoxy resins using silicon containing amide-amines

Author: Khurana P.   Aggarwal S.   Narula A.   Choudhary V.  

Publisher: Springer Publishing Company

ISSN: 1388-6150

Source: Journal of Thermal Analysis and Calorimetry, Vol.71, Iss.2, 2003-02, pp. : 613-622

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Abstract