Novel Fast-Curing Electrically Conductive Adhesives from a Functional Epoxy and Micro Silver Flakes: Preparation, Characterization, and Humid-Thermal Aging

By Cui Hui-Wang   Du Wen-Hui  

Journal of Adhesion, Vol. 89, Iss. 9, 2013-09 ,pp. : 714-726

Taylor & Francis Ltd

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Epoxy Adhesives Modified with Graphene for Thermal Interface Materials

By Prolongo S. G.   Moriche R.   Jiménez-Suárez A.   Sánchez M.   Ureña A.  

Journal of Adhesion, Vol. 90, Iss. 10, 2014-10 ,pp. : 835-847

Taylor & Francis Ltd

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Analysis of correlation between percolation concentration and elongation at break in filled electroconductive epoxy-based adhesives

By Novak I.   Krupa I.   Chodak I.  

European Polymer Journal, Vol. 39, Iss. 3, 2003-03 ,pp. : 585-592

Elsevier

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Effect of structure on thermal behaviour of epoxy resins

By Jain P.   Choudhary V.   Varma I.K.  

European Polymer Journal, Vol. 39, Iss. 1, 2003-01 ,pp. : 181-187

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Preparation of activated carbon filled epoxy nanocomposites: Morphological and thermal properties

By Abdul Khalil H.   Firoozian P.   Jawaid M.   Akil H.   Hassan A.  

Journal of Thermal Analysis and Calorimetry, Vol. 113, Iss. 2, 2013-08 ,pp. : 623-631

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