Investigation of the effect of indium addition on wettability of Sn-Ag-Cu solders

Author： Moser Z.   Fima P.   Bukat K.   Sitek J.   Pstrus J.   Gasior W.   Koscielski M.   Gancarz T.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.23, Iss.1, 2011-02, pp. : 22-29

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