Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and low-to-moderate formaldehyde concentrations

Author： Mishra K.   Paramguru R.  

Publisher： Springer Publishing Company

ISSN： 1543-1916

Source： Metallurgical and Materials Transactions B, Vol.30, Iss.2, 1999-04, pp. : 223-229

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