Bulk-alloy microstructural analogues for transient liquid-phase bonds in the NiAl/Cu/Ni system

Author: Gale W.   Abdo Z.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.30, Iss.12, 1999-12, pp. : 3111-3124

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract