Microstructural evolution at the bonding interface during the early-stage infrared active brazing of alumina

Author: Shiue R.   Wu S.   O J.   Wang J.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.31, Iss.10, 2000-10, pp. : 2527-2536

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Abstract