Solvent Debinding Behavior of Powder Injection Molded Components Prepared from Powders with Different Particle Sizes

Author: Hwang K.S.   Shu G.J.   Lee H.J.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.36, Iss.1, 2005-01, pp. : 161-167

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Abstract