A Study of Transient Liquid-Phase Bonding of Ag-Cu Using Differential Scanning Calorimetry

Author: Kuntz M.L.   Zhou Y.   Corbin S.F.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.37, Iss.8, 2006-08, pp. : 2493-2504

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract