Author: Ohnuma I. Ishida K. Moser Z. Gąsior W. Bukat K. Pstruś J. Kisiel R. Sitek J.
Publisher: Springer Publishing Company
ISSN: 1547-7037
Source: Journal of Phase Equilibria & Diffusion, Vol.27, Iss.3, 2006-06, pp. : 245-254
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Bukat K. Sitek J. Kisiel R. Moser Z. Gasior W. Koscielski M. Pstrus J.
Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. :
Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum
JOM, Vol. 56, Iss. 6, 2004-06 ,pp. :