Atomistic simulation of Ni-Pd alloy sputtering by 0.5-50 keV Ar ions

Author: Shulga V. I.  

Publisher: Taylor & Francis Ltd

ISSN: 1042-0150

Source: Radiation Effects and Defects in Solids, Vol.164, Iss.1, 2009-01, pp. : 1-7

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Abstract

Sputtering of Ni5Pd and NiPd5 alloys by 0.5-50 keV Ar ions has been studied by means of binary-collision simulation. Special attention was given to the angular distributions of sputtered atoms at the steady-state conditions and to the relevant concentrations of Ni and Pd surface atoms, SNi and SPd, respectively. The simulation results were compared with the experimental data published recently. The best-fit values of SNi and SPd favor segregation of Pd in Ni5Pd and segregation of Ni in NiPd5. For a Ni5Pd alloy, it is expected that the ratio SNi/SPd will increase with energy, at least up to 10-20 keV.