Current and Future High Density FRAM Technology

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Integrated Ferroelectrics, Vol. 61, Iss. 1, 2004-01 ,pp. : 3-15

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Integration Technology of Interlayer and Intermetallic Dielectrics for High Density 32Mb FRAM

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NOVEL BC PLUG TECHNOLOGY FOR HIGHLY RELIABLE MASS PRODUCTIVE 0.18 μ M 1T1C COB EMBEDDED FRAM

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Advanced Encapsulating Barrier Layer Technology for 0.25 μm 1T1C 32Mbit FRAM

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A VISION OF FRAM AS A FUSION MEMORY

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