Grain boundary structure of nanocrystalline Cu processed by cryomilling

Author: Huang J. Y.   Liao X. Z.   Zhu Y. T.   Zhou F.   Lavernia E. J.  

Publisher: Taylor & Francis Ltd

ISSN: 1478-6443

Source: Philosophical Magazine, Vol.83, Iss.12, 2003-04, pp. : 1407-1419

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Abstract