Effect of novel alkaline copper slurry on 300 mm copper global planarization

Author： Weijuan Liu   Yuling Liu   Chenwei Wang   Guodong Chen   Mengting Jiang   Haobo Yuan   Pengfei Cheng  

Publisher： IOP Publishing

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.35, Iss.9, 2014-09, pp. : 96003-96006

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