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Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration
Publisher: IOP Publishing
ISSN: 1674-4926
Source: Journal of Semiconductors, Vol.35, Iss.11, 2014-11, pp. : 116002-116007
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
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