Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer

By Su Lei   Shi Tielin   Xu Zhensong   Lu Xiangning   Liao Guanglan  

Sensors, Vol. 13, Iss. 12, 2013-11 ,pp. : 16281-16291

MDPI

Access to resources Recommend Favorite

Enhanced Design for Flip Chip Interconnects

By Elsherbeni A.Z.   Rodriguez-Pereyra V.   Smith C.E.  

Journal of Electromagnetic Waves and Applications, Vol. 12, Iss. 1, 1998-01 ,pp. : 23-38

Taylor & Francis Ltd

Access to resources Recommend Favorite

Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules

By Singh Preetpal   Yeh Der-Hwa   Tan Cher-Ming   Lai Chao-Sung   Hou Chih-Teng   Chao Ting-Yu   Chang Liann-Be  

Applied Sciences, Vol. 6, Iss. 6, 2016-06 ,pp. : 179-179

MDPI

Access to resources Recommend Favorite

High-Sensitivity Low-Noise Miniature Fluxgate Magnetometers Using a Flip Chip Conceptual Design

By Lu Chih-Cheng   Huang Jeff   Chiu Po-Kai   Chiu Shih-Liang   Jeng Jen-Tzong  

Sensors, Vol. 14, Iss. 8, 2014-07 ,pp. : 13815-13829

MDPI

Access to resources Recommend Favorite

Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

By Matteucci Marco   Heiskanen Arto   Zór Kinga   Emnéus Jenny   Taboryski Rafael  

Sensors, Vol. 16, Iss. 11, 2016-10 ,pp. : 1795-1795

MDPI

Access to resources Recommend Favorite