Finite element analysis of influence of passivation layer on Cu/low-k structure during thermosonic Cu wire bonding
Publisher： IOP Publishing
ISSN： 1757-899X
Source： IOP Conference Series: Materials Science and Engineering, Vol.61, Iss.1, 2014-08, pp. : 245-251
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Optimization of Cu/Low-k Dual Damascene Post-Etch Residue and TiN Hard Mask Removal
Solid State Phenomena, Vol. 2016, Iss. 255, 2016-10 ,pp. :
Access to resources
Recommend
Access to resources