Optimization of Cu/Low-k Dual Damascene Post-Etch Residue and TiN Hard Mask Removal

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2016|255|237-241

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2016, Iss.255, 2016-10, pp. : 237-241

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Abstract

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