Publisher： John Wiley & Sons Inc
E-ISSN： 1098-2760|57|3|643-645
ISSN： 0895-2477
Source： MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, Vol.57, Iss.3, 2015-03, pp. : 643-645
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Thermal stability of on-chip copper interconnect structures
By Gutmann R.J. Chow T.P. Muraka S.P. Kaloyeros A.E. Lanford W.A.
Thin Solid Films, Vol. 262, Iss. 1, 1995-06 ,pp. :
Access to resources
Recommend
