Thermal stability of on-chip copper interconnect structures

Author： Gutmann R.J.   Chow T.P.   Muraka S.P.   Kaloyeros A.E.   Lanford W.A.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.262, Iss.1, 1995-06, pp. : 177-186

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