A Theoretical Study of Thin Film Delamination Using Clamped Punch-Loaded Blister Test: Energy Release Rate and Closed-Form Solution

By Sun Jun-yi  

Journal of Adhesion Science and Technology, Vol. 25, Iss. 16, 2011-08 ,pp. : 2063-2080

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The constrained blister test for the energy of interfacial adhesion

By Napolitano M.J.   Chudnovsky A.   Moet A.  

Journal of Adhesion Science and Technology, Vol. 2, Iss. 1, 1988-01 ,pp. : 311-323

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The use of stimulated boundary gas release for determination of the adhesion of thin films by the blister test

By Borisenko Yu N.   Gritsyna V.T.   Ivko T.V.  

Journal of Adhesion Science and Technology, Vol. 9, Iss. 11, 1995-01 ,pp. : 1413-1426

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A comparative study of three adhesion tests (EN 582, similar to ASTM C633, LASAT (LASer Adhesion Test), and bulge and blister test) performed on plasma sprayed copper deposited on aluminium 2017 substrates

By Arrigoni M.   Barradas S.   Braccini M.   Dupeux M.   Jeandin M.   Boustie M.   Bolis C.   Berthe L.  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 5, 2006-04 ,pp. : 471-487

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Adhesion (fracture energy) of electropolymerized poly(n-octyl maleimide-co-styrene) coatings on copper substrates using a constrained blister test

By Liang Jeng-Li  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 8, 1993-01 ,pp. : 869-884

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