Flip‐chip bonding and fabrication of well‐ordered nanocolumn arrays on sputter‐deposited AlN/Si (111) substrate

Publisher： John Wiley & Sons Inc

E-ISSN： 1862-6319|212|5|992-996

ISSN： 1862-6300

Source： PHYSICA STATUS SOLIDI (A) APPLICATIONS AND MATERIALS SCIENCE, Vol.212, Iss.5, 2015-05, pp. : 992-996

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