Sputter-deposited Mo and reactively sputter-deposited Mo-N films as barrier layers against Cu diffusion

Author: Chuang J.-C.   Tu S.-L.   Chen M.-C.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.346, Iss.1, 1999-06, pp. : 299-306

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Abstract