Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Publisher： John Wiley & Sons Inc

E-ISSN： 1099-1638|31|4|543-566

ISSN： 0748-8017

Source： QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, Vol.31, Iss.4, 2015-06, pp. : 543-566

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