散热强化型覆晶球栅数组组合体之锡球可靠度研究An Investigation of the Solder Ball Reliability for a Thermally Enhanced FC-PBGA Assembly

ISSN： 2160-7575

Source： Applied Physics, Vol.4, Iss.7, 2014-07, pp. : 141-154

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

散热强化型覆晶球栅数组封装组合体内的凸块之疲劳寿命研究 Investigation of Fatigue Life of Solder Bumps in a Thermally Enhanced FC-PBGA Assembly

By 刘天培吴俊煌朱圣浩赖新一

Applied Physics, Vol. 02, Iss. 01, 2012-01 ,pp. : 20-27

汉斯出版社

Access to resources Recommend Favorite

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, Vol. 31, Iss. 4, 2015-06 ,pp. : 543-566

John Wiley & Sons Inc

Access to resources Recommend Favorite

Finite-element analysis of a PBGA assembly under isothermal/mechanical twisting loading

By Yang Q.J. Shi X.Q. Wang Z.P. Shi Z.F.

Finite Elements in Analysis and Design, Vol. 39, Iss. 9, 2003-06 ,pp. : 819-833

Elsevier

Access to resources Recommend Favorite

Thermally Triggered Frame‐Guided Assembly

ANGEWANDTE CHEMIE INTERNATIONAL EDITION, Vol. 53, Iss. 49, 2014-12 ,pp. : 13468-13470

John Wiley & Sons Inc

Access to resources Recommend Favorite

Thermally Triggered Frame‐Guided Assembly

ANGEWANDTE CHEMIE, Vol. 126, Iss. 49, 2014-12 ,pp. : 13686-13688

John Wiley & Sons Inc

Access to resources Recommend Favorite