Microstructures and Properties of Graphene‐Cu/Al Composite Prepared by a Novel Process Through Clad Forming and Improving Wettability with Copper

Publisher： John Wiley & Sons Inc

E-ISSN： 1527-2648|17|5|663-668

ISSN： 1438-1656

Source： ADVANCED ENGINEERING MATERIALS (ELECTRONIC), Vol.17, Iss.5, 2015-05, pp. : 663-668

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