Effect of Interface Evolution on Thermal Conductivity of Vacuum Hot Pressed SiC/Al Composites

Publisher: John Wiley & Sons Inc

E-ISSN: 1527-2648|17|7|1076-1084

ISSN: 1438-1656

Source: ADVANCED ENGINEERING MATERIALS (ELECTRONIC), Vol.17, Iss.7, 2015-07, pp. : 1076-1084

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract