Related content

Room temperature wafer bonding of silicon, oxidized silicon, and crystalline quartz

By Bengtsson Stefan   Amirfeiz Petra  

Journal of Electronic Materials, Vol. 29, Iss. 7, 2000-07 ,pp. : 909-915

Springer Publishing Company

Access to resources Recommend Favorite

Single-Crystalline Silicon Layer Transfer to a Flexible Substrate Using Wafer Bonding

By Byun Ki  

Journal of Electronic Materials, Vol. 39, Iss. 10, 2010-10 ,pp. : 2233-2236

Springer Publishing Company

Access to resources Recommend Favorite

Removal of residual CuO particles on the post CMP wafer surface of multi-layered copper

By Yan Li   Ming Sun   Xinhuan Niu   Yuling Liu   Yangang He   Hailong Li   Aochen Wang   Hongbo Li  

Journal of Semiconductors, Vol. 35, Iss. 4, 2014-04 ,pp. : 46001-46008

IOP Publishing

Access to resources Recommend Favorite

The Stability, Scalability and Performance of Multi-agent Systems

By Lee L.C.   Nwana H.S.   Ndumu D.T.   de Wilde P.  

BT Technology Journal, Vol. 16, Iss. 3, 1998-07 ,pp. : 94-103

Springer Publishing Company

Access to resources Recommend Favorite

LBIC and Reflectance Mapping of Multicrystalline Si Solar Cells

By Moralejo B.  

Journal of Electronic Materials, Vol. 39, Iss. 6, 2010-06 ,pp. : 663-670

Springer Publishing Company

Access to resources Recommend Favorite