Removal of residual CuO particles on the post CMP wafer surface of multi-layered copper

Author： Yan Li Ming Sun Xinhuan Niu Yuling Liu Yangang He Hailong Li Aochen Wang Hongbo Li

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.35, Iss.4, 2014-04, pp. : 46001-46008

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