Full RLGC model extraction of Through Silicon Via (TSV) with charge distribution effects

Author: Luo Guang-Xiao   Wei Xing-Chang   Hao Ran   Cui Xiang   Li Er-Ping  

Publisher: Taylor & Francis Ltd

ISSN: 1569-3937

Source: Journal of Electromagnetic Waves and Applications, Vol.28, Iss.13, 2014-09, pp. : 1596-1609

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