Direct bonding of silicon wafers with the concurrent formation of diffusion layers

Author： Grekhov I. Kostina L. Argunova T. Belyakova E. Shmidt N. Kostin K. Kim E. Kim S.

ISSN： 1063-7842

Source： Technical Physics, Vol.46, Iss.6, 2001-06, pp. : 690-695

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