Direct bonding of silicon carbide wafers with a regular relief at the interface

Author： Grekhov I.   Kostina L.   Argunova T.   Belyakova E.   Je J.   Ivanov P.   Samsonova T.  

Publisher： MAIK Nauka/Interperiodica

ISSN： 1063-7850

Source： Technical Physics Letters, Vol.32, Iss.5, 2006-05, pp. : 453-455

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