

Author: Hang Da-Ren Chen Chenlong Liang Chi-Te Chou Mitch M C
Publisher: IOP Publishing
ISSN: 0268-1242
Source: Semiconductor Science and Technology, Vol.29, Iss.8, 2014-06, pp. : 85004-85009
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content







