Effect of Ag-content on structure, corrosion behaviour and mechanical properties of Sn-9Zn lead-free solder alloy

By Gouda El Said   Abdel Aziz H.   El Gendy Y.   Saad Allah F.   Hammam M.  

EPJ Applied Physics (The), Vol. 52, Iss. 3, 2010-11 ,pp. : 31302-31302

Edp Sciences

Access to resources Recommend Favorite

Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate

By Erer A. M.   Candan E.   Güven M. H.   Turen Y.  

EPJ Applied Physics (The), Vol. 54, Iss. 1, 2011-04 ,pp. : 11302-11302

Edp Sciences

Access to resources Recommend Favorite

Effect of cooling rate on structure and creep behavior of Sn-0.7Cu-0.5Zn lead-free solder alloy

By Gouda E. S.  

EPJ Applied Physics (The), Vol. 48, Iss. 2, 2009-09 ,pp. : 20902-20902

Edp Sciences

Access to resources Recommend Favorite

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

By  

MATEC Web of conference, Vol. 27, Iss. issue, 2015-10 ,pp. : 02003-02003

Edp Sciences

Access to resources Recommend Favorite

Effects of voids on thermal-mechanical reliability of lead-free solder joints

By  

MATEC Web of conference, Vol. 12, Iss. issue, 2014-06 ,pp. : 04026-04026

Edp Sciences

Access to resources Recommend Favorite