Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate

Author： Erer A. M.   Candan E.   Güven M. H.   Turen Y.  

Publisher： Edp Sciences

E-ISSN： 1286-0050|54|1|11302-11302

ISSN： 1286-0042

Source： EPJ Applied Physics (The), Vol.54, Iss.1, 2011-04, pp. : 11302-11302

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