Progress and developments in the field of materials for transient liquid phase bonding and active soldering processes

Author： Lugscheider E.   Ferrara S.   Janssen H.   Reimann A.   Wildpanner B.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.10, Iss.3, 2004-03, pp. : 233-236

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