Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

Author： Wunderle B.   Auersperg J.   Großer V.   Kaulfersch E.   Wittler O.   Michel B.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.10, Iss.5, 2004-08, pp. : 375-381

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