Effects of microstructure on the mechanical properties of copper films for high aspect ratio structures

Author： Cordill M. J.   Muppidi T.   Moody N. R.   Bahr D. F.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.10, Iss.6-7, 2004-10, pp. : 451-455

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Determination of mechanical properties of slip cast, micro powder injection moulded and microcast high aspect ratio microspecimens

By Auhorn M.   Beck T.   Schulze V.   Löhe D.  

Microsystem Technologies, Vol. 10, Iss. 6-7, 2004-10 ,pp. : 489-492

Springer Publishing Company

Access to resources Recommend Favorite

Process research of high aspect ratio microstructure using SU-8 resist

By Liu J.   Cai B.   Zhu J.   Ding G.   Zhao X.   Yang C.   Chen D.  

Microsystem Technologies, Vol. 10, Iss. 4, 2004-05 ,pp. : 265-268

Springer Publishing Company

Access to resources Recommend Favorite

High-aspect-ratio microstructure filling by centrifugal force field modeling

By Tsai T.-H.   Yang H.   Chein R.  

Microsystem Technologies, Vol. 10, Iss. 6-7, 2004-10 ,pp. : 571-577

Springer Publishing Company

Access to resources Recommend Favorite

High aspect ratio glass structures produced by means of the drawing technology

By Hesse A.  

Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. : 1541-1544

Springer Publishing Company

Access to resources Recommend Favorite

Eutectic bonding of Al-based high aspect ratio microscale structures

By Mei Fanghua   Jiang J.   Meng W.  

Microsystem Technologies, Vol. 13, Iss. 7, 2007-04 ,pp. : 723-730

Springer Publishing Company

Access to resources Recommend Favorite