Combination of thick resist and electroforming technologies for monolithic inkjet application

Author： Chung C. K.   Lin C. J.   Chen C. C.   Fang Y. J.   Tsai M. Q.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.10, Iss.6-7, 2004-10, pp. : 462-466

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