Selection of mold materials for electroforming of monolithic two-layer microstructure

Author： Chung C. K.   Lin C. J.   Wu L. H.   Fang Y. J.   Hong Y. Z.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.10, Iss.6-7, 2004-10, pp. : 467-471

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