High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging

Author： Lin C.-J.   Lin M.-T.   Wu S.-P.   Tseng F.-G.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.10, Iss.6-7, 2004-10, pp. : 517-521

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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