Wafer-level reliability characterization for wafer-level-packaged microbolometer with ultrasmall array size

Author： Yang Chung   Jung Ho   Park Jae   Kim Hee  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.20, Iss.4-5, 2014-04, pp. : 889-897

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