Solder bonding with a buffer layer for MOEMS packaging using induction heating

Author： Hu Chao-Chang   Wen Shih-Yi   Hsu Chen-Peng   Chang Chun-Wei   Shih Chih-Tsung   Lee Hsiao-Wen  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.12, Iss.10-11, 2006-09, pp. : 1011-1014

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