Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

Author： Worgull M.   Hétu J.   Kabanemi K.   Heckele M.  

Publisher： Springer Publishing Company

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.12, Iss.10-11, 2006-09, pp. : 947-952

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