

Author: Datta Proyag Goettert Jost
Publisher: Springer Publishing Company
ISSN: 0946-7076
Source: Microsystem Technologies, Vol.13, Iss.3-4, 2007-02, pp. : 265-270
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content


Studies of polymer deformation and recovery in micro hot embossing
Microsystem Technologies, Vol. 14, Iss. 7, 2008-07 ,pp. :


Submicron polymer structures with X-ray lithography and hot embossing
By Mappes Timo
Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. :


SOI wafer mold with high-aspect-ratio microstructures for hot embossing process
Microsystem Technologies, Vol. 10, Iss. 6-7, 2004-10 ,pp. :

