![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Woytasik M. Grandchamp J.-P. Dufour-Gergam E. Martincic E. Gilles J.-P. Megherbi S. Lavalley V. Mathet V.
Publisher: Springer Publishing Company
ISSN: 0946-7076
Source: Microsystem Technologies, Vol.12, Iss.10-11, 2006-09, pp. : 973-978
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Copper planar microcoils applied to magnetic actuation
Microsystem Technologies, Vol. 14, Iss. 7, 2008-07 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Fabrication and test of multilayer microcoils with a high packaging density
By Ruffert C.
Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. :