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Author: Woytasik Marion
Publisher: Springer Publishing Company
ISSN: 0946-7076
Source: Microsystem Technologies, Vol.14, Iss.7, 2008-07, pp. : 951-956
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Abstract
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Fabrication and test of multilayer microcoils with a high packaging density
By Ruffert C.
Microsystem Technologies, Vol. 14, Iss. 9-11, 2008-10 ,pp. :