Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application

Author： PengHui YuenSchool of Physics   Universiti Sains Malaysia   Penang   Malaysia   DevarajanMutharasuSchool of Physics   Universiti Sains Malaysia   Penang   Malaysia   LeeTeik ToonSolid State Lighting Department   OSRAM Opto Semiconductor Sdn. Bhd.   Penang   Malaysia   LaceyDavidResearch and Innovation Department   OSRAM Opto Semiconductor Sdn. Bhd.   Penang   Malaysia  

Publisher： Emerald Group Publishing Ltd

E-ISSN： 1758-6836|27|4|129-136

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.27, Iss.4, 2015-09, pp. : 129-136

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